Pcb assembly provider right now? What we provide is not only PCB & MCPCB manufacturing, but also including PCB duplicating, Engineering & process design, components management & sourcing solution, PCB in house assembly & full system integration, surface mounted technology (SMT), full products assembly & testing. Read additional details on pcb assembly. Quality Policy: PCB Quality is the core of products. All of engineer & vital department guys has more than five years expenrience in PCB industry, we follow up the default PCB standard, as well as with clients’ special request.
Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple.
In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Read more information at https://www.bstpcb.com/.
Generally speaking, aluminum is the most economic option considering thermal conductivity, rigidness, and cost. Therefore, the base/core material of normal Metal Core PCB are made of aluminum. In our company, if not special request, or notes, the metal core refer will be aluminum, then MCPCB will means Aluminum Core PCB. If you need Copper Core PCB, Steel Core PCB, or Stainless steel core PCB, you should add special notes in drawing.