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Orthogonal frequency division multiple access OFDMA: Friends who are familiar with Wi-Fi should know that the empty port of Wi-Fi adopts orthogonal frequency division multiplexing (OFDM) modulation, that is, the whole bandwidth is composed of orthogonal subcarriers. In Wi-Fi 6, the 802.11 working group introduced OFDMA access from LTE. The addition of such an “A” word can be said to have brought a qualitative change to the network capacity. As shown in the figure on the left below, Wi-Fi 5-based OFDM can only allocate all the bandwidth in the channel to one user at any one time, even if that user’s data needs do not need to take up all the bandwidth. When other users connect to the network, they need to wait for the next sending opportunity window (TXOP). This is very inefficient in the use of channel resources, especially when there is a significant increase in equipment.
Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.
Key Technologies of SoC Design: SoC key technologies mainly include bus architecture technology, IP core reuse technology, software and hardware co-design technology, SoC verification technology, testability design technology, low-power design technology, ultra-deep sub-micron circuit implementation technology, and embedded software porting. A circuit system capable of realizing certain functions is composed of multiple modules, such as processors, interfaces, memories, analog-to-digital converters, and so on. These functional modules can be implemented by discrete devices, and then combined on a printed circuit board (PCB) to finally form a system-on-a-Board. A schematic diagram of the on-board system is shown below.
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